Power Electronic Components by BFi OPTiLAS

Tputty™ gap fillers are used to bridge the interface between hot components and a chassis or heat sink assembly when elimination of mechanical stress or bulk dispensing are critical design considerations. Tpli™ gap fillers are used where high thermal conductivity and low pressures are required. Tgon™ 800 is a high-performance, cost-effective TIM that can be used where electrical isolation is not required. Tgon 800’s unique grain oriented graphite plate structure provides high 240 W/mK thermal conductivity along the XY plane, and 5 W/mK through the Z axis.
	Target Applications: Industrial – LED lighting, power supplies, power converters, lighting ballasts, controllers Aerospace and military – power supplies, microwave radio, and controllers Telecom – wireless infrastructure, routers, and VOIP phones IT – notebooks, servers, memory modules, hard disk drivers, solid state drives, scanners, printers Consumer – gaming systems, LCD PDP televisions, and displays