Wells-CTI Open Top 0.65mm pitch CSP Socket

Wells CTI

1000-0 Series - 0.65mm Open Top CSP Socket

Wells-CTI Open Top 0.5mm CSP Socket, Spring & Probe Contact for Microarray Packages.

• Open Top Chip Scale Package
  
• Accommodates pitch sizes of 0.50mm
  
• Compression surface mount
  
• Spring and probe contact
  
• Pointed probe maintains continuous contact to PCB
  
• Spring loaded floating locator plate

Wells CTI

715 Series - 0.50mm Open Top CSP Socket

Wells-CTI Clamshell 0.75 & 0.80mm pitch FBGA/CSP Socket, "Y" Contact

• Clamshell design
  
• Patented "Y" contact
  
• Pivoting pressure pad for uniform pressure
  
• Modular design allows for easy customisation
  
• Spring loaded ejection

Wells CTI

654 Series - 0.75 & 0.80mm Clamshell CSP Socket

Wells-CTI Clamshell 0.75 & 0.80mm pitch CSP Socket, "Y" Contact

• Zero insertion force design for automatic loading
  
• Patented "Y" contact
  
• Mechanical ejection plate
  
• For 0.75mm & 0.80mm pitch package
  

Wells CTI

703 Series - 0.75 & 0.80mm Open Top CSP Socket

Wells-CTI Clamshell 0.5mm pitch CSP Socket, Spring & Probe Contact for Microarray Packages.

Wells CTI

718 Series - 0.50mm Clamshell CSP Socket

Wells-CTI Open Top CSP, 0.5 & 0.65mm Pitch, 4 Point Pinch Contact.

• Open Top Chip Scale Package
  
• Accommodates pitch sizes of 0.75mm & 0.80mm
  
• Compact size and low actuation force
  
• 4-point pinch design for enhanced electrical contact
  
• Unique mechanism to eliminate solder ball sticking

Wells CTI

777 Series - 0.75 & 0.80mm Open Top CSP Socket

Wells-CTI Open Top CSP, 0.80 x 1.00mm Pitch, 4 Point Pinch Contact.

• Open Top Chip Scale Package
  
• Accommodates pitch sizes of 0.80mm x 1.00mm
  
• Compact size and low actuation force
  
• 4-point pinch design for enhanced electrical contact
  
• Maximum package size is 11.0 x 18.5mm

Wells CTI

778 Series - 0.80 x 1.00mm Open Top CSP Socket